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Hologram, Inc. SIM-ST-MFF2

GLOBAL IOT EMBEDDED SIM CHIP

Manufacturer:
Hologram, Inc.
Manufacturer Part:
SIM-ST-MFF2
Datasheet:
Hologram, Inc. SIM-ST-MFF2 Datasheet(PDF)

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Attribute Value
Mfr Hologram, Inc.
Series -
Package Tape & Reel (TR);Cut Tape (CT);Custom-Reel
Product Status Discontinued at Custom-Key
Format ESIM (MFF2)
Class -
Memory -
Core Processor -
Carrier Network -
Network Technology 2G, 3G, 4G LTE IOT
Features -
Operating Temperature -
Size / Dimension 5mm L x 6mm W x 0.82mm H